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TOP STORY Updated Mon, 22 Oct 2007 10:33:15 AM EDT Is fab lite on analog's diet? As digital IDMs increasingly turn to foundries for their production needs, an inevitable question arises: Will the big analog IDMs follow the same path and move toward fab-lite or even fabless strategies? LATEST NEWS Startup tries proprietary path to wireless hi-fi In-house capacity is an analog vendor's trump card Real analog IDMs have fabs--but at what cost? Intel still has ground to cover City commute for Darpa driverless cars Lithium battery has longer life, says startup Planar Updated: Four chip makers in China added to U.S. export list Large named new NRO director Qualcomm: ITC judge recommends end to Nokia probe Metamaterials to enable 3-D displays   See all LATEST News

Stirring the wireless stew The “intel” in Intel’s numbers A Crass and Empty Web 2.0 Blog Main Page Read Crosstalk Send a Letter

Building secure wireless ad hoc networks: Part 3 In the conclusion of a three part series, Praphul Chandra applies the fundamentals of ad hoc wireless network security to the implementation of a Bluetooth network, detailing its various security modes. MORE DESIGN ARTICLES Fundamentals of embedded video, part 5 How to write secure C/C++ application code for your embedded design: Part 3 Google Trends CCFL controllers achieve 300:1 dimming ratio Measuring battery current with precision Search Design Articles DDR2 SO-DIMMs target ATCA, embedded applications White Electronic Designs has expanded its high-performance memory module family with the release of three DDR2 2-Gbyte modules. MORE PRODUCTS DDR3 memory module pair exceeds JEDEC specifications Power MOSFETs feature high drain current, low on-state resistance Processor-based advanced mezzanine cards debut Low-power MIPS64 processor series breaks the 1-W per core barrier Miniature optical transceivers target Ethernet, Fibre Channel apps Search New Products

DESIGN NEWS

India hitches its star to embedded design model From the perspective of technology development and manufacturing, India can be a tough read--especially compared with its booming neighbor China, the world's factory.

NXP names Cadence 'primary' EDA supplier as firms sign multiyear deal Uncovering hidden chip costs Viewpoint: RTL-ers should move to ESL Big EDA firms not prepared to drive 3D integration, says panel Will mobile video play in the U.S. market?

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SEMICONDUCTOR NEWS

Renesas alters fab, foundry strategy Seeking to make up ground at the 65-nm node and beyond, Japanese chip giant Renesas Technology Corp. is quietly altering its fab and foundry strategies.

Tensilica plans IPO, CEO says IC Insights raises annual IC unit growth forecast Hynix cuts capex, preps non-memory thrust Elpida to finish shift to bigger wafers in March Having recruited DRAM makers IMEC is ramping flash research

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